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Back-side Metallization for Power Devices | SPTS
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Analytics for US Patent No. 8222118, Wafer backside grinding with stress relief
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Flip-Chip and Backside Techniques
US20160379926A1 - Semiconductor Wafer Backside Metallization With Improved Backside Metal Adhesion - Google Patents
300MM BACKSIDE METALLIZATION PROCESSES
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PDF) Development of a laser-assisted bonding process for a flip-chip die with backside metallization
Impact of Backside Metallization Film Stress on Vce(sat) of Field-stop Trench IGBT
Hua Hong Semiconductor Limited
Increasing the capacity for Power MOSFET Backside Metallization
Chipbond Website
Figure 5 from Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology | Semantic Scholar
MOSFET Wafer Thinning-FSM-BGBM- Backend Process - iST-Integrated Service Technology - MOSFET Wafer Backend Process (BGBM)
OnChip Offers Semiconductor Wafer Backside Metallization | OnChip Devices, Inc. - Global Leader in Integrated Passive Devices
a) shows the joint between the diode backside metallization and the... | Download Scientific Diagram
Backside Metallization for Power Devices - News
Wafer-level backside processing of high-frequency indium phosphide chips
Metal Evaporation Wafer Thining FSM BGBM Backside metallization │iST - Metal Evaporation Deposition for Backside Metallization
Backside Metallization for Power Devices - News
Reflection data of different kinds of backside metallization. | Download Scientific Diagram
